Full development support from Ideation > R&D > Prototyping > NPI > Production > End of Life
Employ Design to Cost, Design For Manufacturing, and Design For Assembly methodologies to minimize revision count
Design collaboration with 3D CAD aids from concept visualization to production grade photo-realistic rendering
PCBA layout analysis including polyimide flexible circuit design, and subsequent assembly cooling requirements
Environmental simulation testing including vibration, shock, seismic, altitude, handling, temperature, humidity, and electromagnetic susceptibility/broadcasting
Linear and non-linear Finite Element Analysis (FEA) simulation in 3D CAD for physical and thermal loads
Assessment of deformation-defined Factor of Safety (FS)
Characterization of optical deformation and residual stress from thermal expansion and/or CTE mismatch
Forecast transient system temperature rise and response
Rapid fabrication of custom components via in house manufacturing in partnership with a strong network of local specialists.
Capabilities:
CNC machined components utilizing 5-axis milling/turning
Sheet metal: fiber laser, waterjet, CNC punch, forming, captive hardware
Low volume production - additive manufacturing (3D printing) including multi-material FDM, SLS, and SLA processes
Medium volume production - silicone based soft mold casting
High volume production - injection molding with low and high pressure production rigs
Structural adhesives and dielectric potting of PCBAs for undersea or extreme environment applications
Welding of conventional materials (ex. aerospace-grade aluminum and stainless steel), premium materials (ex. moly steel and titanium alloys), and exotic metals (ex. Kovar, Inconel, and Hastelloy)
Multi-axis robotics implementation including Articulating 5DOF, SCARA, and Delta architectures with application-specific End of Arm Tool
Machine learning based vision system integration
System design focused on precision sub-assembly choreography to optimize duty cycle and throughput
High-flex / high-cycle harness design with MIL-spec connectorization
Compression interposer (Samtec Z-Ray) integration for ultra high-cycle count with ultra low-profile stack up
Ceramic and reinforced composite PCB design for high-BGA count chips and active optical PCBAs
Project schedule planning with real-time updates
Product risk reduction via Design Failure Mode Effect Analysis (DFMEA) process
Supply chain logistics planning, production forecasting, and supplier negotiation
On-site installation management, staff training, and inspection for QA/QC
Maintenance and reliability analysis for forecasting consumables, spare parts, and product lifespan